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□ PCB Technological level ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Our highlights are: High-layer PCBs High-density PCBs High Frequency PCBs Lead Free and Halogen Free PCBs Our Technological level: PCB (Printed Circuit Board) | Technology parameter | Data | | Min. Line Width/Spaces(mils) | 4.0/4.0 (0.004" (0.1 mm)) | | Max. Layer Count | 20 | | layer to layer registration tolerance (mil) | 6(0.006"(0.15mm)) | | Board thickness | Double-sided:0.02", 0.031", 0.039", 0.047", 0.062", 0.078", 0.094" Maximum board thickness :0.13" | | Base materials | FR-4, FR-406, FR-408, FR-5, G10, CEM3 | | Copper foil | 0.5 oz, 1 oz, 2 oz, 4 oz, 6 oz | | Min. PTH - Mechanical (mils) | 6 (0.008" (0.2mm)) | | Max. Aspect Ratio | 10:1 | | Impedance Control(%) | 5 | | Tolerance of board thickness(mm) | +/-5%( Board thickness more than 1.0mm ) | | Silkscreen/Legend colors | white, black, yellow, pink, red | | Solder Mask | Green, Yellow, Red, Blue, Purple, Silver, Gold, Black | | Gold finger/Max gold thickness | 1.25 mm (50 micro-inches) | | Plating | HAL Lead-tin, Immersion gold , Immersion nickel, Electrolytic gold , Immersion tin, OSP | | Lead free Process | High Tg/Haloge Rree (>180℃) | | Flatness | 0.1% | | Thin board(mm) | Small Volume( 0.05 ) | | Thick board(mm) | 10.0 | | Buried resistor/Capacitance | Embedded Resistance |
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